Preparation Technology of Nanoscale Ultrafine Grain Cobalt-free Cemented Carbide

Beijing University of Science and Technology recently introduced nano-scale ultrafine grain cobalt-free cemented carbide preparation technology. The technology consists of three parts:
The first part of the technology provides raw materials for the production of ultra-fine particles of WC powder. Only the particle size of WO3 powder ≤ 500nm can guarantee the production of WC powder particle size ≤ 300nm. At present, the first part of the technology can guarantee the daily (24 hours) production of 20 ~ 25Kg ultra-fine particle WO3 powder (using ultrasonic spray heat conversion technology).
The second part of the technology can mainly provide WC powder with an average particle size of ≤300nm. It is currently possible to guarantee a single design capability to produce 20-30 Kg of WC powder of 20-30 Kg daily (24 hours).
The third part of the technology is mainly ensured by various special molding equipment and special sintering equipment and corresponding operating techniques. Currently has mastered the conventional pressure change and vacuum - medium pressure sintering process. Through experiments, the average grain size of WC powder of ultra-fine-grained carbide can be ≤50nm, the alloy hardness is ≥90.7, and the bending strength of the alloy is ≥3000N.
Because nano-size hard alloys have higher strength, hardness, and wear resistance than conventional hard alloys, they play an important role in modern industries. According to Japanese industry statistics, in the computer circuit board processing industry, 60 million pieces of nano-size hard alloy twist drills (about 18 billion yen) are required each year, but currently Japan does not have nano-size hard alloy production technology, so only Can use (0.5 ~ 1.5μm) micron carbide replacement.
At present, micron-grade hard alloys with very high performance of 30 tons per year are soon adopted by the computer industry. Other industries such as precision machinery, machining tools, special wear-resistant materials and parts, drawing dies, high-performance automated cutting tools, and optical components are in greater demand.